TY  - BOOK
AU  - Jin, Yufeng
AU  - Wang, Zhiping
AU  - Chen, Jing
TI  - Introduction to microsystem packaging technology
SN  - 9781138374256
U1  - 621.381046 JIN/I 
PY  - 2011///
CY  - New York, 
PB  - CRC Press
KW  - MICROELECTRONIC PACKAGING
KW  - MEMS
KW  - INTERCONNECTION TECHNOLOGY
KW  - OPTOELECTRONICS
ER  -