Jin, Yufeng <br/><br/>
Introduction to microsystem packaging technology 

 - New York,   CRC Press,  2011. 
 - xiii,218p. 
<br/><br/><label>ISBN: </label>9781138374256 
<br/><br/><label>Subjects--Topical Terms: </label><br/>MICROELECTRONIC PACKAGING<br/>MEMS<br/>INTERCONNECTION TECHNOLOGY<br/>OPTOELECTRONICS
<br/><br/><label>Dewey Class. No.: </label>621.381046 JIN/I