TY  - BOOK
AU  - Elfadel, Ibrahim (Abe) M. (Eds.)
AU  - Fettweis, Gerhard
TI  - 3D stacked chips: From Emerging processes to heterogeneous systems
SN  - 9783319793054
U1  - 621.3815 ELF/D 
PY  - 2016///
CY  - Switzerland
PB  - Springer
KW  - ELECTRONICS/ ELECTRICAL ENGINEERING
KW  - 3D INTEGRATION
KW  - INTEGRATED CHIPS
ER  -