Elfadel, Ibrahim (Abe) M. (Eds.) <br/><br/>
3D stacked chips:  From Emerging processes to heterogeneous systems 
Ibrahim (Abe) M. Elfadel, Gerhard Fettweis 
 - Switzerland,  Springer,  2016 
 - xxiii, 339p. 
<br/><br/><label>ISBN: </label>9783319793054 
<br/><br/><label>Subjects--Topical Terms: </label><br/>ELECTRONICS/ ELECTRICAL ENGINEERING<br/>3D INTEGRATION<br/>INTEGRATED CHIPS
<br/><br/><label>Dewey Class. No.: </label>621.3815 ELF/D