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3D stacked chips: From Emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis
Material type:
TextPublication details: Switzerland, Springer, 2016Description: xxiii, 339pISBN: - 9783319793054
- 621.3815 ELF/D
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Kerala University of Digital Sciences, Innovation and Technology Knowledge Centre Applied Electronics | Non Fiction | 621.3815 ELF/D (Browse shelf(Opens below)) | Available | 5702 |
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| 621.381 SEN/M;1 Microsystem design | 621.381 SEN/M;2 Microsystem design | 621.381 SRI/C Carbon-based electronics: Transistors and interconnects at the nanoscale | 621.3815 ELF/D 3D stacked chips: From Emerging processes to heterogeneous systems | 621.3815 FAK/P Pathological elements in analog circuit design | 621.3815 HAL/A Ageing of integrated circuits: Causes, effects and mitigation techiques | 621.3815 HAR/H Hybrid ADCs, smart sensors for the IoT, and sub-1V & advanced node analog circuit design: Advances in analog circuit design 2017 |
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