Progress in Metal Additive Manufacturing and Metallurgy
Progress in Metal Additive Manufacturing and Metallurgy
English[eng]
residual stress/strain||electron beam melting||diffraction||Ti-6Al-4V||electron backscattered diffraction||X-ray diffraction||Selective Laser Melting||Ti6Al4V||residual stress||deformation||preheating||relative density||powder degradation||wire and arc additive manufacturing||additive manufacturing||microstructure||mechanical properties||applications||Fe-based amorphous coating||laser cladding||property||titanium||microstructural modeling||metal deposition||finite element method||dislocation density||vacancy concentration||directed energy deposition||defects||hardness||alloy 718||hot isostatic pressing||post-treatment||Alloy 718||surface defects||encapsulation||coating||fatigue crack growth (FCG)||electron beam melting (EBM)||hydrogen embrittlement (HE)||wire arc additive manufacturing||precipitation hardening||Al–Zn–Mg–Cu alloys||microstructure characterisation||titanium alloy||Ti55511||synchrotron||XRD||microscopy||SLM||EBM||EBSD||Rietveld analysis||WAAM||GMAW||energy input per unit length||processing strategy||contact tip to work piece distance||electrical stickout
English[eng]
residual stress/strain||electron beam melting||diffraction||Ti-6Al-4V||electron backscattered diffraction||X-ray diffraction||Selective Laser Melting||Ti6Al4V||residual stress||deformation||preheating||relative density||powder degradation||wire and arc additive manufacturing||additive manufacturing||microstructure||mechanical properties||applications||Fe-based amorphous coating||laser cladding||property||titanium||microstructural modeling||metal deposition||finite element method||dislocation density||vacancy concentration||directed energy deposition||defects||hardness||alloy 718||hot isostatic pressing||post-treatment||Alloy 718||surface defects||encapsulation||coating||fatigue crack growth (FCG)||electron beam melting (EBM)||hydrogen embrittlement (HE)||wire arc additive manufacturing||precipitation hardening||Al–Zn–Mg–Cu alloys||microstructure characterisation||titanium alloy||Ti55511||synchrotron||XRD||microscopy||SLM||EBM||EBSD||Rietveld analysis||WAAM||GMAW||energy input per unit length||processing strategy||contact tip to work piece distance||electrical stickout